Rodriguez, Rennier S. and Graycochea Jr, Edwin M. and Seguido, Rammil A. and Gomez, Frederick Ray I. (2020) Die Attach Process Optimization with Enhanced Epoxy Control on Leadframe Package. Journal of Engineering Research and Reports, 14 (2). pp. 32-37. ISSN 2582-2926
![[thumbnail of sciencedomain,+Rodriguez1422020JERR58026.pdf]](http://library.eprintdigipress.com/style/images/fileicons/text.png)
sciencedomain,+Rodriguez1422020JERR58026.pdf - Published Version
Download (312kB)
Abstract
The paper presents a practical procedure in selecting the best candidate for die attach epoxy control or anti-epoxy bleed-out (anti-EBO) concentration during the introduction of new leadframe configuration. Three different criteria were implemented to measure the relative impact of the anti-EBO into the different interfaces inside a quad-flat no-leads multi-row (QFN-mr) leadframe unit. Die shear test is performed to measure the shear strength and the compatibility of the anti-EBO to the adhesive material. EBO measurement is performed herewith to study the propagation of epoxy bleed-out on the surface of the leadframe with reference to the different level of anti-EBO concentration. Package reliability is employed study the response of different interfaces directly in-contact with anti-EBO through thermal-cycling scenario. Ultimately, understanding the effect of anti-EBO into different set of tests provided a systematic way of selecting appropriate leadframe parameters for QFN-mr leadframe product.
Item Type: | Article |
---|---|
Subjects: | East Asian Archive > Engineering |
Depositing User: | Unnamed user with email support@eastasianarchive.com |
Date Deposited: | 08 Apr 2023 08:03 |
Last Modified: | 30 May 2024 13:37 |
URI: | http://library.eprintdigipress.com/id/eprint/317 |